| Sponsor |
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High Force and Large area bond tester
The most powerful bond tester to test IGBTs, power modules and large batteries up to 1000 kgf. Sigma HF/L offers flexible positioning and operates with the fastest axis speed. Learn more.
xyztec
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| Press Release |
November 17, 2025 - Click the title to read the full press release.
As one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and ...
Indium Corporation
December 3, 2025
Indium Expert to Tackle Reliability Challenges in AI at EPTC 2025
Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). ...
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December 1, 2025
Indium Corporation to Share Expertise on Thermal Interface Materials at Upcoming INEMI Webinar
A technical presentation on thermal interface materials (TIMs) will be featured at an upcoming webinar organized by the International Electronics Manufacturing Initiative ...
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November 17, 2025
Indium Corporation to Feature Thermal Materials Solutions for High-Performance Computing at SC25
As one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and ...
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November 12, 2025
Indium Corporation is Electrifying the Future with Advanced Materials Solutions at Productronica
As one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium ...
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October 23, 2025
Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus ...
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October 22, 2025
Indium Introduces 2026 DIY Internship Program to Empower the Next Gen of Industry Leaders
Indium Corporation is proud to announce its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape a personalized professional ...
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October 15, 2025
Indium Corporation to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTAI
As one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA ...
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October 7, 2025
Indium Corporation Commemorates 30th Anniversary of Asia-Pacific Hub in Singapore
Indium Corporation celebrates 30 years of service at its Asia-Pacific Operations (APO) facility. Located in Singapore, the facility serves customers worldwide, particularly ...
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October 2, 2025
Indium Corporation Features Next-Generation Materials for Semiconductor Assembly at IMAPS
Indium Corporation will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics ...
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October 1, 2025
Indium Corporation Expert to Present on Innovative Thermal Management Solution at IMAPS Thermal Conference
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on a new liquid metal containment method for thermal ...
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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