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Press Release
November 17, 2025  -  Click the title to read the full press release.

StratEdge Celebrates IMAPS Awards for President Tim Going and VP Casey Krawiec



StratEdge Corporation is proud to announce that President Tim Going has been awarded the prestigious IMAPS Founders Award, recognizing his technical and leadership ...

StratEdge Corporation
November 17, 2025
StratEdge Celebrates IMAPS Awards for President Tim Going and VP Casey Krawiec
StratEdge Corporation is proud to announce that President Tim Going has been awarded the prestigious IMAPS Founders Award, recognizing his technical and leadership ...
September 30, 2025
StratEdge Highlights High-Performance Packaging at IMAPS and BCICTS
StratEdge Corporation will showcase its thermally efficient line of post-fired and molded ceramic packages at two upcoming events: Booth 719 at the IMAPS International Symposium ...
August 28, 2025
StratEdge to Display Packaging Innovation at European Microwave Week Exhibition
StratEdge Corporation will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth A095 at European Microwave Week (EuMW), ...
June 16, 2025
StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336
StratEdge Corporation will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336 at the International Microwave Symposium ...
May 7, 2025
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
StratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech, taking place May 19–21 at the Hilton New Orleans ...
April 14, 2025
From Extreme Heat to Orbit: StratEdge Displays RF and High-Power Solutions at iMAPS HiTEC and CMSE
StratEdge Corporation announces that it will be showcasing its latest advancements in high-temperature packaging technology at the iMAPS HiTEC Power Packaging ...
February 26, 2025
StratEdge Powers Up for 2025: Showcasing Latest Molded Ceramic Packages at IMAPS and GOMACTech
StratEdge Corporation will reveal its newest molded ceramic package configurations at two premier events this March: the IMAPS Device Packaging Conference and the GOMACTech ...
January 23, 2025
StratEdge Corporation Partners with Vitale Engineering as Manufacturer's Representative
StratEdge Corporation has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach ...
January 15, 2025
VIEWPOINT 2025: Casey Krawiec, VP of Global Sales, StratEdge Corporation
November 26, 2024
StratEdge Wins Prestigious IMAPS 2024 Corporate Recognition Award
StratEdge Corporation is proud to announce that it has been awarded the 2024 IMAPS Corporate Recognition Award. The prestigious award was presented on October 1, 2024 ...
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
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