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Sponsor
Henkel-AG-Co

Copper vs silver: a turning point for WBG die attach
Copper sintering is challenging silver's dominance in power semiconductors. Read how new materials are enabling high performance at lower cost.
Henkel AG & Co.
Pac-Tech
Press Release
November 14, 2025  -  Click the title to read the full press release.

Global Semiconductor Industry Outlook 2026: AI, Edge Computing & Sustainability to Shape the Growth Wave



The global semiconductor industry is entering a transformative phase in 2026, driven by accelerated adoption of Artificial Intelligence (AI), edge computing, electric vehicles ...

Markets and Markets
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Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
SEIKA-America