semiconductor
packaging news
Sponsor
Surfx-Technologies

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
Hydrogen plasmas drive breakthroughs in 3D chip technology, enabling ultra-dense interconnects and faster signal speeds above 5 GHz.
Surfx Technologies
Amkor-Technology
Press Release
November 10, 2025  -  Click the title to read the full press release.

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation



Advanced Semiconductor Engineering, Inc. (ASE) announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform. The enhanced ...

Advanced Semiconductor Engineering, Inc. (ASE)
November 10, 2025
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
Advanced Semiconductor Engineering, Inc. (ASE) announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform. The enhanced ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
SEIKA-America

SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
kyzen