Sponsor

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science

Press Release

November 10, 2025 - Click the title to read the full press release.

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

Advanced Semiconductor Engineering, Inc. (ASE) announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform. The enhanced ...

Advanced Semiconductor Engineering, Inc. (ASE)

November 10, 2025
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
Advanced Semiconductor Engineering, Inc. (ASE) announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform. The enhanced ...

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Sponsor

Is copper sintering the future of WBG semiconductors?
Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology.
Henkel AG & Co.