| Press Release |
November 4, 2025 - Click the title to read the full press release.
At this year's SEMICON Europe, Kaijo Corporation is presenting the MPB-2000, a new fully automatic, high-performance Thermosonic Large Area Bonder. With a bonding area ...
Kaijo Corporation
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Particle-Free Plasma Oxide Reduction
Ar/H2 plasma for flux-free flip chip bonding. Low temp, uniform 100 mm wide beams. Fast oxide removal. No damage or particles. Contact us for integration into your TCB bonder.
Surfx Technologies
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