| Press Release |
November 4, 2025 - Click the title to read the full press release.
At this year's SEMICON Europe, Kaijo Corporation is presenting the MPB-2000, a new fully automatic, high-performance Thermosonic Large Area Bonder. With a bonding area ...
Kaijo Corporation
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Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation
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