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Sponsor
ZEISS

See WLCSP Defects with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL & Cu-pillar microbumps. Read more.
ZEISS Microscopy
Pac-Tech
Press Release
November 4, 2025  -  Click the title to read the full press release.

Nordson Test & Inspection Launches Advanced Inspection and Metrology Solutions at SEMICON Europa



Nordson TEST & INSPECTION announced plans to exhibit with distributor partners at Productronica and SEMICON Europa, scheduled to take place November 18-21 at the ...

Nordson Test & Inspection
November 4, 2025
Nordson Test & Inspection Launches Advanced Inspection and Metrology Solutions at SEMICON Europa
Nordson TEST & INSPECTION announced plans to exhibit with distributor partners at Productronica and SEMICON Europa, scheduled to take place November 18-21 at the ...
October 2, 2025
Nordson Test & Inspection Unveils Latest Inspection and Metrology Solutions at SEMICON West 2025
Nordson TEST & INSPECTION announced plans to exhibit at SEMICON West 2025, scheduled to take place October 7-9th at the Phoenix Convention Center in Arizona. Visitors ...
August 12, 2025
Nordson Test & Inspection Delivers Technical Presentation at the HI Global Summit
Nordson Test & Inspection announced plans to present on Day 2 at the Heterogeneous Integration Global Summit (HIGS), during SEMICON Taiwan at the TaiNex in Taipei ...
September 6, 2024
Nordson TEST & INSPECTION Showcases Inspection and Metrology Solutions at SEMICON Taiwan
Nordson TEST & INSPECTION announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The event will take place ...
June 12, 2024
Nordson Test & Inspection to Showcase Advanced Semiconductor Technologies at SEMICON West 2024
Nordson TEST & INSPECTION announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at the Moscone Center ...
August 30, 2023
Nordson TEST & INSPECTION showcases inspection and metrology solutions at SEMICON Taiwan
Nordson TEST & INSPECTION announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The company will be ...
June 26, 2023
Nordson TEST & INSPECTION Features Quadra 7 Pro MXI System at SEMICON West 2023
Nordson TEST & INSPECTION announced that it will highlight the new Quadra 7 Pro Manual X-ray Inspection (MXI) System and demonstrate ...
June 17, 2021
AQS, Inc. Selects DAGE Assure Intelligent X-ray Component Counter for Mass Production
Nordson X-ray is pleased to announce that EMS provider AQS, Inc. purchased an Assure™ intelligent X-ray component counter. Nordson X-ray is part of Nordson TEST ...
June 7, 2021
SVTronics Implements New DAGE Assure Intelligent X-ray Component Counter
Nordson X-ray is pleased to announce a successful installation of the Assure™ intelligent X-ray component counter to SVTronics. The company purchased the Assure™ from Nordson X-ray ...
May 18, 2021
Nordson Welcomes Her Majesty's Vice Lord-Lieutenant of Buckinghamshire to Its UK Headquarters
Nordson Test & Inspection division, part of the Nordson Corporation, was delighted to welcome Mr. Alexander Boswell, Her Majesty’s Vice Lord-Lieutenant of Buckinghamshire ...
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Sponsor
Tresky

Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation
SEIKA-America