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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
November 4, 2025 - Click the title to read the full press release.
Hprobe, a Mycronic company, announces the introduction of its new magnetic test instrument dedicated to wafer-level testing of the latest generation of TMR sensors under ...
Hprobe
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