Sponsor

Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.

Press Release

November 3, 2025 - Click the title to read the full press release.

Hitachi High-Tech Announces the SU9600

Hitachi High-Tech Corporation has launched the Ultrahigh-Resolution Scanning Electron Microscope SU9600, which allows for highly accurate and precise observation of substances ...

Hitachi High-Tech Corporation

November 3, 2025
Hitachi High-Tech Announces the SU9600
Hitachi High-Tech Corporation has launched the Ultrahigh-Resolution Scanning Electron Microscope SU9600, which allows for highly accurate and precise observation of substances ...

March 18, 2024
Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System
Hitachi High-Tech Corporation announced the launch of the LS9300AD, a new system for inspecting the front and backside of non-patterned wafer surfaces for particles ...

December 12, 2023
Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI4600
Hitachi High-Tech Corporation announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI4600 ...

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Sponsor

1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG