Sponsor

See WLCSP Defects with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL & Cu-pillar microbumps. Read more.
ZEISS Microscopy

Press Release

November 3, 2025 - Click the title to read the full press release.

Hitachi High-Tech Announces the SU9600

Hitachi High-Tech Corporation has launched the Ultrahigh-Resolution Scanning Electron Microscope SU9600, which allows for highly accurate and precise observation of substances ...

Hitachi High-Tech Corporation

November 3, 2025
Hitachi High-Tech Announces the SU9600
Hitachi High-Tech Corporation has launched the Ultrahigh-Resolution Scanning Electron Microscope SU9600, which allows for highly accurate and precise observation of substances ...

March 18, 2024
Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System
Hitachi High-Tech Corporation announced the launch of the LS9300AD, a new system for inspecting the front and backside of non-patterned wafer surfaces for particles ...

December 12, 2023
Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System DI4600
Hitachi High-Tech Corporation announced the launch of the Hitachi Dark Field Wafer Defect Inspection System DI4600 ...

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Sponsor

Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation