semiconductor
packaging news
Sponsor
ZEISS

See WLCSP Defects with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL & Cu-pillar microbumps. Read more.
ZEISS Microscopy
Pac-Tech
Press Release
November 3, 2025  -  Click the title to read the full press release.

CoolCAD Electronics Expands Silicon Carbide Portfolio with 3.3 kV Semiconductor Devices



CoolCAD Electronics announced an expansion of its SiC product portfolio with the launch of new 3.3 kV high-power, high-temperature MOSFETs and power components engineered ...

CoolCAD Electronics
November 3, 2025
CoolCAD Electronics Expands Silicon Carbide Portfolio with 3.3 kV Semiconductor Devices
CoolCAD Electronics announced an expansion of its SiC product portfolio with the launch of new 3.3 kV high-power, high-temperature MOSFETs and power components engineered ...
April 3, 2025
CoolCAD Electronics and RFMW Announce Distribution Agreement
RFMW, part of Exponential Technology Group, Inc. announced a strategic partnership with CoolCAD Electronics to enhance its portfolio of high-power and high-voltage silicon carbide ...
July 17, 2024
Ultrafast ID – VG Technique for Reliable Cryogenic Device Characterization
This paper presents a method for ultrafast ID-VG measurements down to 8 K, pivotal for understanding high-k device dynamics in cryogenic environments.
May 20, 2024
Space-Proofing Power: CoolCAD's Mission to Radiation-Harden Power Semiconductor Devices
This paper addresses radiation-induced failures in power semiconductor devices for space applications and outlines NASA's technology roadmap objectives for power and energy storage in space, highlighting areas needing advancement.
January 31, 2024
CoolCAD Electronics partners with Spectrum Sales Inc. to enhance its market presence NY & NJ
CoolCAD announced a strategic partnership with Spectrum Sales Inc. This partnership aims to strengthen CoolCAD's market presence and enhance customer engagement within ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Tresky

Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation
SEIKA-America