| Press Release |
October 31, 2025 - Click the title to read the full press release.
At this year's productronica, Quasys GmbH will be presenting its extensive range of test sockets and change kits for automated testing (ATE – Automated Test Equipment), ...
Quasys GmbH
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Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation
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