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Underfill Epoxy Offers Thermal Conductivity
Master Bond EP29LPTCHT is a low viscosity adhesive that can be used for underfill & encapsulation apps. It offers thermal conductivity & electrical insulation.
Master Bond
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| Press Release |
October 31, 2025 - Click the title to read the full press release.
QP Technologies, together with its parent company Promex Industries, is proud to announce a new partnership with Admati Agencies Ltd., appointing them as the exclusive ...
QP Technologies
October 31, 2025
QP Technologies and Promex Partner with Admati Agencies to Expand in Israel
QP Technologies, together with its parent company Promex Industries, is proud to announce a new partnership with Admati Agencies Ltd., appointing them as the exclusive ...
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October 13, 2025
Promex and QP Technologies Appoint Ben Mendoza Vice President of Military Projects
Microelectronics and packaging assembly leaders Promex Industries, Inc., and its QP Technologies division announced that Ben Mendoza has been named vice president of military ...
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January 22, 2025
VIEWPOINT 2025: Matt Hansen, VP, Sales and Marketing, QP Technologies
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July 31, 2024
Promex Industries and QP Technologies Implement Sales/Marketing Reorganization
Promex Industries and its San Diego-based division QP Technologies announced a sales/marketing reorganization aimed at growing both companies’ core businesses. As part ...
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July 1, 2024
Custom Substrates Enable Fast-Turn Package, Assembly Development
Chip designers can leverage custom substrates to quickly develop optimal packaging and assembly solutions for high-speed, high-performance devices, overcoming time-to-market challenges.
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June 25, 2024
QP Technologies™ Expands Die Preparation Business
QP Technologies™ announced it has added a state-of-the-art dicing saw to its manufacturing line, expanding its die and wafer preparation business. The Disco DFD6362 ...
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April 17, 2024
QP Technologies™ Achieves ANSI/ESD S20.20 Certification
QP Technologies™ announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America Inc. – one of only six certification bodies accredited to issue ...
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February 7, 2024
VIEWPOINT 2024: Ken Molitor, Chief Operating Officer, QP Technologies
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December 5, 2023
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
The white paper details a real-world use case where dummy IC packages converted to Open-Cavity Plastic Packages (OCPP) passed stringent burn-in and MSL tests equivalent to factory-fresh parts.
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October 17, 2023
Optimizing New Power Switch Technology Using Compound Semiconductors
In this white paper, we detail our collaboration with high-profile startup Ideal Power to devise a commercial packaging solution that yielded the industry's first fully functioning B-TRAN™ double-sided power switches.
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