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Amkor-Technology

Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.
Balazs-Nanoanalysis
Press Release
October 30, 2025  -  Click the title to read the full press release.

Greater China MEMS industry on the rise: consumer leads the way



In its latest analysis, Yole Group examines how the Greater Chinese MEMS ecosystem is expanding across the consumer, automotive, industrial, medical, defense, and telecom ...

YOLE Group
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Sponsor
Dr.-Tresky-AG

1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
Akrometrix