Sponsor

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Press Release

October 27, 2025 - Click the title to read the full press release.

From chargers to data centers: power GaN market set for rapid sixfold expansion by 2030

Yole Group announces the release of its new edition of the Power GaN report. This annual bestseller provides an in-depth analysis of the global power GaN market trajectory, ...

Yole Group

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Sponsor

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group