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Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
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| Press Release |
October 22, 2025 - Click the title to read the full press release.
GigaDevice has officially opened its new office in Minato City, Tokyo. This milestone reflects the company's deepening commitment to the Japanese market and marks a significant step ...
GigaDevice
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Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
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