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Henkel-AG-Co

Is copper sintering the future of WBG semiconductors?
Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology.
Henkel AG & Co.
Uyemura
Press Release
October 14, 2025  -  Click the title to read the full press release.

Digital Dynamics Unveils Next-Gen Fusion Control Modules at SEMICON West



Digital Dynamics Inc. (DDI) introduced a suite of powerful new products and capabilities at SEMICON West in Phoenix, Arizona at booth #1283. DDI's Fusion.IO platform

Digital Dynamics Inc.
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Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Intraratio-Corporation