| Press Release |
October 10, 2025 - Click the title to read the full press release.
Junkosha has chosen this year's SEMICON West event to announce the launch of its new self-supporting Flat and High-Flex Cable designed to meet the increasing pressure ...
Junkosha Inc.
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Particle-Free Plasma Oxide Reduction
Ar/H2 plasma for flux-free flip chip bonding. Low temp, uniform 100 mm wide beams. Fast oxide removal. No damage or particles. Contact us for integration into your TCB bonder.
Surfx Technologies
|
|
|
