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Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
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| Press Release |
October 10, 2025 - Click the title to read the full press release.
Festo demonstrates an interconnected workflow for semiconductor manufacturing, focusing on critical wafer handling and processing. The heart of the new Festo application ...
Festo
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