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kyzen

Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.
KYZEN
Master-Bond
Press Release
October 9, 2025  -  Click the title to read the full press release.

Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology



Tobii and STMicroelectronics announced the beginning of mass production of an advanced interior sensing system for a premium European carmaker. It integrates a wide ...

STMicroelectronics
October 16, 2025
STMicroelectronics' half-bridge gate drivers ease design with GaN in low-voltage systems
STMicroelectronics' STDRIVEG210 and STDRIVEG211 half-bridge gallium nitride (GaN) gate drivers are tailored for systems powered from industrial or telecom bus voltages, ...
October 14, 2025
STMicroelectronics powers 48V mild-hybrid efficiency with flexible automotive 8-channel gate driver
Ready for 48V automotive power architectures, the L98GD8 driver from STMicroelectronics has eight fully configurable channels for driving MOSFETs in flexible high-side ...
October 9, 2025
Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology
Tobii and STMicroelectronics announced the beginning of mass production of an advanced interior sensing system for a premium European carmaker. It integrates a wide ...
October 6, 2025
STMicroelectronics' automotive linear voltage regulator preserves battery energy in challenging conditions
L99VR03 300mA low-dropout (LDO) regulator provides resilient and efficient power, with a wide input-voltage range and very low quiescent current consumption, only 3.5µA ...
September 26, 2025
STARLight Project chosen to take the lead in next-gen Silicon Photonics on 300mm wafers
The STARLight project brings together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) ...
September 25, 2025
STMicroelectronics joins FiRa board
STMicroelectronics has announced that Rias Al-Kadi, General Manager of the Company's Range and Connectivity Division, has joined the board of directors of the FiRa® ...
September 23, 2025
Value-optimized power-management IC for automotive applications
The SPSA068 from STMicroelectronics is a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameter ...
September 19, 2025
STMicroelectronics to advance next-gen chip manufacturing technology with new PLP pilot line in Tours, France
STMicroelectronics announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site ...
September 12, 2025
STMicroelectronics sets 20-year availability for popular automotive microcontrollers
STMicroelectronics has extended the ongoing longevity program for its widely deployed SPC58 automotive microcontrollers (MCUs) from 15 years to 20 years, ensuring ...
July 3, 2025
STPay-Topaz-2 next-generation contactless-payment solution boosts flexibility and security
STMicroelectronics has unveiled STPay-Topaz-2, its next-generation contactless payment card system-on-chip (SoC), offering more flexibility to support a wider variety ...
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Indium-Corporation

Proven SiPaste® for Ultrafine-Pitch Printing
Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life.
Indium Corporation
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