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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
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Press Release
September 24, 2025  -  Click the title to read the full press release.

Empower Semiconductor Secures Over $140M in Series D Financing



Empower Semiconductor announced the closing of more than $140M in Series D financing. The investors, led by Fidelity Management & Research Company, include Maverick ...

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3 Days of Advanced Packaging: IMAPS 2025
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