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Wafer Processing Adhesives & Solution
Thin semiconductor chips are common. Backgrinding & thinning process is considered separate, the ability to com-bine wafer backgrinding-thinning & back-side active buildup improves throughput.
AI Technology, Inc.
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| Press Release |
September 23, 2025 - Click the title to read the full press release.
The SPSA068 from STMicroelectronics is a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameter ...
STMicroelectronics
March 18, 2026
STMicroelectronics' single-chip buck converter packs 3A power for appliances, industrial loads
Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics' DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market ...
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March 17, 2026
STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module
STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, ...
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March 11, 2026
STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack
STMicroelectronics has released motor-control software to simplify enhancing drives with AI for optimization and predictive maintenance, ready to load on the EVLSPIN32G4-ACT ...
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March 10, 2026
STMicroelectronics enters high-volume production of its silicon photonics platform
STMicroelectronics is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for ...
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March 4, 2026
STMicroelectronics' sensor and secure wireless technologies support Snapdragon Wear Elite
STMicroelectronics now supports leading-edge motion-sensing and secure wireless technologies on Qualcomm Technologies' newly launched personal AI platform, Snapdragon ...
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March 3, 2026
STMicroelectronics powers up next-gen digital access control
STMicroelectronics has revealed its contribution to accelerating widespread availability of secure, interoperable access-control technology to unlock doors and openings ...
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February 27, 2026
STMicroelectronics' tiny motion sensor boosts comfort and precision in wearable and implantable medical applications
STMicroelectronics' MIS2DU12 MEMS accelerometer combines ultra-low power, signal processing, and an ultra-low profile suitable for wearable and implantable medical ...
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February 26, 2026
STMicroelectronics reveals 75V STSPIN motor-drive ICs for scalable industrial drives
STMicroelectronics' STSPIN9P series of 75V motor-drive ICs accelerates development of robust industrial drives. Suited to operation from popular bus voltages such as 48V ...
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February 25, 2026
STMicroelectronics' new MasterGaN power ICs combine flexibility with advanced GaN technology
STMicroelectronics has introduced MasterGaN6, beginning the second generation of the MasterGaN half-bridge family. The new power system in package couples an updated ...
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February 20, 2026
STMicroelectronics' phase-shift control ICs squeeze more efficiency from resonant converters
STMicroelectronics has introduced the STNRG599A and STNRG599B controllers for resonant-converter topologies with innovative phase-shift control (PSC) that boosts ...
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Corner fill inspection
A memory manufacturer adopted Nordson's AOI system with deep learning to inspect IC corner fill, ensuring accurate detection, measurement, and improved reliability in semiconductor assembly.
Nordson Test & Inspection
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