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Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Pac-Tech
Press Release
September 18, 2025  -  Click the title to read the full press release.

scia Systems Provides Thin-Film Processing Breakthrough for Semiconductor and Optical Device Manufacturing



scia Systems GmbH introduced its all-new cluster solution, the scia Cluster 200, a modular platform for coating, etching, and cleaning processes based on advanced ion beam ...

scia Systems
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XYZTEC

Full automation bond testers
A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more.
xyztec
Amkor-Technology