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One Component, Fast Curing Epoxy
Master Bond EP4EN-80 is a NASA low outgassing approved adhesive for potting and encapsulation. It cures at 80°C and features thermal conductivity and electrical insulation.
Master Bond
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| Press Release |
September 18, 2025 - Click the title to read the full press release.
scia Systems GmbH introduced its all-new cluster solution, the scia Cluster 200, a modular platform for coating, etching, and cleaning processes based on advanced ion beam ...
scia Systems
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Thermal Warpage Testing Services
If you have any questions on your Thermal Warpage and Strain Metrology, our applications engineering experts will provide you with accurate and timely information for all your needs.
Akrometrix
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