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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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| Press Release |
September 12, 2025 - Click the title to read the full press release.
STMicroelectronics has extended the ongoing longevity program for its widely deployed SPC58 automotive microcontrollers (MCUs) from 15 years to 20 years, ensuring ...
STMicroelectronics
September 26, 2025
STARLight Project chosen to take the lead in next-gen Silicon Photonics on 300mm wafers
The STARLight project brings together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) ...
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September 25, 2025
STMicroelectronics joins FiRa board
STMicroelectronics has announced that Rias Al-Kadi, General Manager of the Company's Range and Connectivity Division, has joined the board of directors of the FiRa® ...
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September 23, 2025
Value-optimized power-management IC for automotive applications
The SPSA068 from STMicroelectronics is a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameter ...
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September 19, 2025
STMicroelectronics to advance next-gen chip manufacturing technology with new PLP pilot line in Tours, France
STMicroelectronics announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site ...
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September 12, 2025
STMicroelectronics sets 20-year availability for popular automotive microcontrollers
STMicroelectronics has extended the ongoing longevity program for its widely deployed SPC58 automotive microcontrollers (MCUs) from 15 years to 20 years, ensuring ...
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July 3, 2025
STPay-Topaz-2 next-generation contactless-payment solution boosts flexibility and security
STMicroelectronics has unveiled STPay-Topaz-2, its next-generation contactless payment card system-on-chip (SoC), offering more flexibility to support a wider variety ...
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June 26, 2025
STMicroelectronics' new high-current, low-voltage switching regulators
DCP0606Y automotive step-down converters let designers build extremely compact and efficient step-down power supplies to deliver 6A maximum output current at a voltage ...
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June 25, 2025
Feature-rich, radiation-hardened point-of-load converters for Low Earth Orbit applications
LEOPOL1 point-of-load step-down converter for Low Earth Orbit (LEO) deployments meets the needs of equipment developers targeting the New Space market, now ...
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June 24, 2025
STMicroelectronics extends ISO 26262 compliant automotive family with 8-channel low-side driver
STMicroelectronics' L9800 8-channel automotive low-side driver is ISO 26262 compliant and housed in a compact, leadless outline that saves space in body-control modules, ...
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June 17, 2025
Advanced 1600V IGBTs for cost-sensitive, energy-conscious appliance markets
STGWA30IH160DF2 IGBT combines a breakdown-voltage rating of 1600V and high thermal performance with efficiency in soft-switching topologies and easy paralleling ...
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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