September 15, 2025
ASMPT Introduces ALSI LASER1206 - Fully Automatic Laser Dicing and Grooving
ASMPT Semiconductor Solutions launches the ALSI LASER1206, its latest system for bare wafer handling and separation under Class 1000 cleanroom conditions, at SEMICON ...
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September 10, 2025
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
ASMPT announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions). Gordon joined ASMPT in August with ...
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September 5, 2025
ASMPT Joins "JOINT3" Consortium to Develop Next-Gen Semiconductor Packaging
ASMPT Limited (ASMPT) announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation ...
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August 27, 2025
ASMPT exhibits at SEMICON Taiwan
ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the ...
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August 8, 2025
ASMPT introduces MEGA multi-chip bonding platform
ASMPT SEMI sets the standard in precision and speed with its new MEGA multi-chip bonding platform. The new device family is characterized by high flexibility, a modular ...
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July 14, 2025
ASMPT introduces AERO PRO high-performance wire bonder
ASMPT introduces its latest high-performance wire bonder: the AERO PRO. Developed for high-density semiconductor designs, the AERO PRO delivers the highest bonding ...
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May 16, 2025
ASMPT presents die bonder with intelligent features
ASMPT introduces its flagship INFINITE bonder, which achieves top performance in throughput and quality. With its intelligent features, especially in the areas of adhesive ...
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May 13, 2025
ASMPT at SEMICON SEA showcases comprehensive advanced packaging expertise
ASMPT will be exhibiting at SEMICON Southeast Asia (SEA) from 20 to 22 May 2025 at the Sands Expo and Convention Centre, Singapore (Booth L1613). ASMPT has consistently ...
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March 25, 2025
Accelerating into the AI Era at Light-Speed Innovation
ASMPT will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at the ASMPT booth 5675 during the OFC 2025 trade event being held April 1-3
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March 24, 2025
ASMPT Strengthens its Global Footprint
ASMPT continues to drive the growth of its semiconductor solutions in strategically important markets. To do this, the company relies on experienced industry experts like ...
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