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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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| Press Release |
September 11, 2025 - Click the title to read the full press release.
The global advanced IC substrates market size is expected to reach USD 42.62 billion by 2034, according to a new study by Polaris Market Research. The report "Advanced IC ...
Polaris Market Research
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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