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UV DIE Bonding Special Technology
Liquid adhesive is cured using ultraviolet (UV) light. In contrast to epoxy, the UV adhesive remains in the liquid state until it is exposed to high-energy UV radiation with UV DIE Bonding technology.
Tresky Automation
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| Press Release |
September 11, 2025 - Click the title to read the full press release.
The global advanced IC substrates market size is expected to reach USD 42.62 billion by 2034, according to a new study by Polaris Market Research. The report "Advanced IC ...
Polaris Market Research
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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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