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Temporary Bonding Materials
Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications.
Brewer Science
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| Press Release |
September 11, 2025 - Click the title to read the full press release.
The global advanced IC substrates market size is expected to reach USD 42.62 billion by 2034, according to a new study by Polaris Market Research. The report "Advanced IC ...
Polaris Market Research
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