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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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| Press Release |
September 11, 2025 - Click the title to read the full press release.
The global advanced IC substrates market size is expected to reach USD 42.62 billion by 2034, according to a new study by Polaris Market Research. The report "Advanced IC ...
Polaris Market Research
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