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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
September 9, 2025 - Click the title to read the full press release.
The RF front-end market is undergoing a massive transformation, announces Yole Group in its new report, RF Front-End Module for Mobile 2025. The RF front-end module ...
YOLE Group
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