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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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| Press Release |
September 9, 2025 - Click the title to read the full press release.
JOINT3 is a co-creation evaluation platform established by Resonac Corporation with the aim of accelerating the development of materials, equipment, and design ...
Brewer Science
September 9, 2025
Participating in the Next-Generation Semiconductor Packaging Consortium "JOINT3"
JOINT3 is a co-creation evaluation platform established by Resonac Corporation with the aim of accelerating the development of materials, equipment, and design ...
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August 29, 2025
Brewer Science Presents Materials' Impact in Sustainable Processes, AI, and High-Performance Computing
Brewer Science, Inc. will share its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science will present the role innovative ...
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August 14, 2025
Brewer Science Supports the Restoration of Full R&D Tax Deductibility with the Passage of OBBB
Brewer Science celebrates the restoration of 100% tax deductibility for research and development (R&D) expenses with the passage of the One Big, Beautiful Bill (OBBB). ...
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August 12, 2025
Brewer Science Named 2025 National Top Workplace in Manufacturing Industry
Brewer Science, Inc. has been named a 2025 National Top Workplace in the Manufacturing Industry, marking the fifth consecutive year the company has received this recognition. ...
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June 10, 2025
Brewer Science Presents Materials Innovation for Additive Electronics at TechBlick 2025
Brewer Science, Inc. is presenting "Building Circuits from the Ground Up: Materials Innovation for Additive Electronics at TechBlick: The Future of Electronics Reshaped" in Boston ...
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May 15, 2025
Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025
Brewer Science, Inc. will present innovations in temporary bonding materials at two premier conferences this May: CS MANTECH 2025 and the 75th Electronic Components ...
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May 8, 2025
Brewer Science releases Impact Report 2025
Brewer Science releases its Impact Report 2025, detailing the company's efforts in sustainability, social responsibility, and governance, also referred to as an ESG Report. ...
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May 5, 2025
Brewer Science Unveils Innovative Smart Warehouse Monitor System at IWLA Industry Event
Brewer Science, Inc. proudly introduces its latest innovation in workplace safety and productivity enhancement – the Smart Warehouse Monitor system. Designed to revolutionize ...
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April 22, 2025
Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Tenth Consecutive Year
Brewer Science proudly announces that it has earned Zero Waste to Landfill Certification for the tenth consecutive year. This recognition underscores Brewer Science's unwavering ...
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March 24, 2025
Brewer Science Showcases Water Quality Sensor Innovations at NextFlex Innovation Days 2025
Brewer Science, Inc. will showcase its latest innovations in water quality sensor technology at NextFlex Innovation Days 2025. As a founding member of NextFlex, Dr. Terry Brewer, ...
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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