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Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science
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| Press Release |
September 8, 2025 - Click the title to read the full press release.
The silicon photonics industry is entering a period of rapid growth and diversification, according to Yole Group's new report, Silicon Photonics 2025 – Focus on SOI, SiN, LNOI ...
YOLE Group
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| Sponsor |
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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