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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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| Press Release |
August 14, 2025 - Click the title to read the full press release.
ClassOne Technology announced it is providing its Solstice® S8 single-wafer processing system to Applied Optoelectronics, Inc. to further strengthen AOI's capabilities ...
ClassOne Technology
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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