| Press Release |
August 8, 2025 - Click the title to read the full press release.
AGY is proud to announce the launch of L-HDI, a new Low Coefficient of Thermal Expansion (CTE) glass fiber engineered specifically for advanced packaging substrates and ...
AGY
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| Sponsor |
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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