| Sponsor |
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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
August 8, 2025 - Click the title to read the full press release.
AGY is proud to announce the launch of L-HDI, a new Low Coefficient of Thermal Expansion (CTE) glass fiber engineered specifically for advanced packaging substrates and ...
AGY
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