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Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science
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| Press Release |
August 8, 2025 - Click the title to read the full press release.
Applied Materials, Inc. is working with Apple and Texas Instruments (TI) to bolster the semiconductor manufacturing supply chain in the United States. Applied is supporting ...
Applied Materials
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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