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"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
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July 28, 2025  -  Click the title to read the full press release.

Teledyne HiRel Semiconductors Releases Compact 16GB DDR4 Module for High-Reliability Applications



Teledyne HiRel Semiconductors announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) ...

Teledyne HiRel Semiconductors
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Master-Bond

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP54TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively.
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