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Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.
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| Press Release |
July 17, 2025 - Click the title to read the full press release.
Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66+ direct-write lithography system, solidifying its position as the ultimate research ...
Heidelberg Instruments Mikrotechnik GmbH
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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