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Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.
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| Press Release |
July 15, 2025 - Click the title to read the full press release.
Visitor registration for SEMICON India 2025, scheduled to be held from 2nd to 4th September 2025 at Yashobhoomi (India International Convention and Expo Centre), New Delhi ...
SEMI
November 6, 2025
SEMI Reports Worldwide Silicon Wafer Shipments Increase 3% YoY in Q3 2025
The SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year ...
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October 31, 2025
SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market ...
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October 27, 2025
NNME Debuts ChipPath as the Central Gateway for U.S. Semiconductor Careers
To help meet the growing demand for skilled workers in the U.S. semiconductor and microelectronics industry, the National Network for Microelectronics Education (NNME), ...
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October 23, 2025
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
SEMICON Japan 2025 will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight. The event will showcase ...
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October 15, 2025
SEMI Foundation, in Partnership with NSF, Opens National RFP for Regional Nodes
The SEMI Foundation announced the official opening of the Regional Node Request for Proposals (RFP) for the National Network for Microelectronics Education (NNME), ...
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October 14, 2025
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook. This robust investment ...
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October 9, 2025
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q2 2025
Electronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter ...
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October 7, 2025
SEMICON Europa 2025 to Highlight Innovations to Bolster Europe's Semiconductor Resilience
Semiconductor industry experts will convene at SEMICON Europa 2025, November 18-21 at Messe München in Munich, to explore the latest trends and innovations in advanced ...
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September 23, 2025
SEMI Issues Statement on U.S. H1-B Visa Policy Announcement
SEMI released the following statement from SEMI Americas President Joe Stockunas on the United States H1-B policy proclamation issued by President Trump on September 19 ...
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September 11, 2025
SEMI Showcases New Conductor™ Intelligence Platform for Enhanced Global Supply Chain Collaboration
SEMI announced its new Conductor™ intelligence platform for enhanced supply chain management at SEMICON Taiwan. The platform was developed as part of the SEMI Supply ...
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| Sponsor |
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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