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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

July 14, 2025 - Click the title to read the full press release.

Innovations in Optics Promotes Two Senior Staff Members to President and Dir. of Engineering

Innovations in Optics, Inc. (IOI) is pleased to announce the promotion of two key staff members: Joe Chevalier has been named President, and David Pierce has been ...

Innovations in Optics, Inc.

July 14, 2025
Innovations in Optics Promotes Two Senior Staff Members to President and Dir. of Engineering
Innovations in Optics, Inc. (IOI) is pleased to announce the promotion of two key staff members: Joe Chevalier has been named President, and David Pierce has been ...

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Chiplets and Advanced Packaging
Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now.
XYZTEC