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Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.
KYZEN
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July 7, 2025 - Click the title to read the full press release.
Test your BGA153 device using high performance 31GHz spring pin socket and low 14g force per pin. Small footprint (only 2.5mm larger than device per side) allows capacitors ...
Ironwood Electronics
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Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
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