| Sponsor |
|
Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
|
|
| Press Release |
July 3, 2025 - Click the title to read the full press release.
SEMI and TechSearch International announced the release of the 2025 edition of the Worldwide Semiconductor Assembly & Test Facility Database, the industry's most comprehensive ...
SEMI
April 22, 2026
SEMICON Southeast Asia 2026 to Convene Leaders in Malaysia
SEMICON Southeast Asia 2026, the region's premier platform for the global semiconductor and electronics manufacturing supply chain, will return to the Malaysia International ...
|
April 15, 2026
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter ...
|
April 10, 2026
SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% Year-on-Year
Worldwide sales of semiconductor manufacturing equipment increased 15% to $135.1 billion in 2025 from $117.1 billion in 2024, driven by continued investment in advanced ...
|
April 7, 2026
SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
Worldwide 300mm fab equipment spending is expected to increase 18% to $133 billion in 2026 and 14% to $151 billion in 2027, SEMI reported today in its latest 300mm Fab ...
|
March 10, 2026
MEMS & Sensors Executive Congress 2026 to Explore MEMS and Sensors at the Edge of Perception
Industry leaders across the global MEMS and sensors ecosystem will convene March 31–April 2 at the MEMS & Sensors Executive Congress (MSEC 2026) at the Hyatt Regency ...
|
February 25, 2026
VIEWPOINT 2026: Melissa Grupen-Shemansky, CTO and VP of Technology Coalitions, SEMI
|
February 16, 2026
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
Worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same ...
|
February 2, 2026
SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stability
SEMI announced its 2026 U.S. Policy Strategy: Securing the Semiconductor Supply Chain to Enable American AI Leadership designed to strengthen U.S. competitiveness ...
|
January 27, 2026
FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics
The FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid ...
|
January 21, 2026
SEMI Foundation Approved by the U.S. Department of Labor
The SEMI Foundation announced it has been officially approved by the U.S. Department of Labor (USDOL) as a National Apprenticeship Sponsor, a major milestone that ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Proven Flip-Chip Flux for AI Packages
WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications.
Indium Corporation
|
|
|