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Sponsor
Ontos-Equipment-Systems

Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos
Circuit-Technology-Center
Press Release
July 3, 2025  -  Click the title to read the full press release.

SEMI and TechSearch Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database



SEMI and TechSearch International announced the release of the 2025 edition of the Worldwide Semiconductor Assembly & Test Facility Database, the industry's most comprehensive ...

SEMI
November 20, 2025
SEMI Applauds Introduction of New Bill to Extend U.S. Tax Credit for Semiconductor Manufacturing Suppliers through 2031
SEMI announced support for the introduction of the Strengthening Essential Manufacturing and Industrial Investment Act (the SEMI Investment Act) in the United States House ...
November 6, 2025
SEMI Reports Worldwide Silicon Wafer Shipments Increase 3% YoY in Q3 2025
The SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year ...
October 31, 2025
SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market ...
October 27, 2025
NNME Debuts ChipPath as the Central Gateway for U.S. Semiconductor Careers
To help meet the growing demand for skilled workers in the U.S. semiconductor and microelectronics industry, the National Network for Microelectronics Education (NNME), ...
October 23, 2025
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
SEMICON Japan 2025 will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight. The event will showcase ...
October 15, 2025
SEMI Foundation, in Partnership with NSF, Opens National RFP for Regional Nodes
The SEMI Foundation announced the official opening of the Regional Node Request for Proposals (RFP) for the National Network for Microelectronics Education (NNME), ...
October 14, 2025
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook. This robust investment ...
October 9, 2025
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q2 2025
Electronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter ...
October 7, 2025
SEMICON Europa 2025 to Highlight Innovations to Bolster Europe's Semiconductor Resilience
Semiconductor industry experts will convene at SEMICON Europa 2025, November 18-21 at Messe München in Munich, to explore the latest trends and innovations in advanced ...
September 23, 2025
SEMI Issues Statement on U.S. H1-B Visa Policy Announcement
SEMI released the following statement from SEMI Americas President Joe Stockunas on the United States H1-B policy proclamation issued by President Trump on September 19 ...
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kyzen

Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation
This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more.
KYZEN
Indium-Corporation