| Sponsor |
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High-Speed, Reliable Plating with PACLINE®
PACLINE® delivers high-throughput, precision electroless plating with full automation—ideal for UBM, RDL, and wafer-level packaging in semiconductor production. View Solution.
PacTech
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| Press Release |
July 3, 2025 - Click the title to read the full press release.
SEMI and TechSearch International announced the release of the 2025 edition of the Worldwide Semiconductor Assembly & Test Facility Database, the industry's most comprehensive ...
SEMI
July 16, 2025
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
Electronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, ...
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July 15, 2025
SEMI and India Semiconductor Mission (ISM) Announce the Opening of Visitor Registrations for SEMICON® India 2025
Visitor registration for SEMICON India 2025, scheduled to be held from 2nd to 4th September 2025 at Yashobhoomi (India International Convention and Expo Centre), New Delhi ...
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July 9, 2025
SEMICON Taiwan 2025 to Spearhead Opportunities for Global Semiconductor Collaboration and Innovation
SEMI announced its 30th annual SEMICON Taiwan event – the premier conference and exhibition for the global semiconductor industry. SEMICON Taiwan 2025 will ...
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July 8, 2025
SEMI and Linx Consulting Unveil Wafer Fab Materials Quarterly Report
SEMI launched the new Wafer Fab Materials Quarterly report in collaboration with Linx Consulting. SEMI recently acquired select assets from Linx Consulting, including market ...
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July 3, 2025
SEMI and TechSearch Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database
SEMI and TechSearch International announced the release of the 2025 edition of the Worldwide Semiconductor Assembly & Test Facility Database, the industry's most comprehensive ...
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June 27, 2025
SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
SEMI reported findings from its latest 300mm Fab Outlook report. The report shows global front-end semiconductor suppliers are accelerating expansion efforts to support ...
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June 25, 2025
SEMI Acquires Linx Consulting's Market Reports and Conferences to Boost Industry Insights
SEMI announced the strategic acquisition of select assets from Linx Consulting, a leading market intelligence and consulting firm to the semiconductor, display, photovoltaic, ...
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June 19, 2025
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
FlexTech issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ...
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June 18, 2025
Phoenix to Host SEMICON West 2025 for the First Time
SEMI announced strategic partnerships for this year's SEMICON® West with Alliance Sponsors Arizona Commerce Authority (ACA), Greater Phoenix Economic Council (GPEC), ...
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June 16, 2025
SEMI Announces Election of Tien Wu, ASE CEO, as International Board Chair
SEMI announced that its International Board of Directors has elected Dr. Tien Wu, CEO of Advanced Semiconductor Engineering, Inc. (ASE), as its new chair, and ...
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