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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

July 3, 2025 - Click the title to read the full press release.

ELSPES Advances Silicon Capacitor Density to 2,500 nF/mm² with Ultra-Low Impedance Profile

ELSPES Inc. has announced the successful development of its next-generation highdensity silicon capacitor, now achieving capacitance densities up to 2,500 nF/mm². This ...

ELSPES Inc.

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Chiplets and Advanced Packaging
Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now.
XYZTEC