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Epoxy for Dam-and-Fill Applications
Master Bond EP17HTDM-2 Black is a high temperature resistant, non-drip adhesive for bonding, sealing, encapsulating and dam-and-fill applications.
Master Bond
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| Press Release |
July 2, 2025 - Click the title to read the full press release.
Pragmatic Semiconductor Ltd. announced the appointment of John Quigley as Executive Vice President (EVP) of Engineering with responsibility for Technology Development, ...
Pragmatic Semiconductor
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Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
xyztec
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