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Circuit-Technology-Center

Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center
EV-Group
Press Release
June 6, 2025  -  Click the title to read the full press release.

RECIF Technologies Presents R.PACK Software Suite: The next step in efficiency and control



RECIF Technologies is pleased to announce the launch of R.PACK, the next-generation software suite designed for RECIF sorters. With an emphasis on usability, efficiency, ...

RECIF Technologies
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Surfx-Technologies

Particle-Free Plasma Oxide Reduction
Ar/H2 plasma for flux-free flip chip bonding. Low temp, uniform 100 mm wide beams. Fast oxide removal. No damage or particles. Contact us for integration into your TCB bonder.
Surfx Technologies
Plasma-Etch