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Pac-Tech

How LAPLACE® Laser Assisted Bonding Saves Energy
LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo.
PacTech
Tresky
Press Release
June 6, 2025  -  Click the title to read the full press release.

WIN Semiconductors Announces Linearity Optimized 0.12µm Gallium Nitride Power Process



WIN Semiconductors Corp announces the launch of its NP12-1B, a groundbreaking 0.12 μm gate-length depletion-mode (D-mode) Gallium Nitride (GaN) High Electron Mobility ...

WIN Semiconductors Corp
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Sponsor
Advanced-Component-Labs

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.
Surfx-Technologies