semiconductor
packaging news
Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Ontos-Equipment-Systems
Press Release
June 2, 2025  -  Click the title to read the full press release.

China's pivotal role in automotive semiconductor innovation



Yole Group launches its first automotive White Paper, Vol. 1 — Part of the 2025 White Paper Collection. The automotive industry is undergoing a profound transformation. ...

Yole Group
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Henkel-AG-Co

Is copper sintering the future of WBG semiconductors?
Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology.
Henkel AG & Co.
Pac-Tech