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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
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| Press Release |
May 28, 2025 - Click the title to read the full press release.
Imec announced their collaboration with Massachusetts Institute of Technology (MIT), a renowned research university in advanced technology and science to research ...
Imec
December 11, 2025
Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures
At the 2025 IEEE International Electron Devices Meeting (IEDM), imec presents the first thermal system-technology co-optimization (STCO) study of 3D HBM-on-GPU ...
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December 3, 2025
imec and Brewer Science to Co-Present Breakthroughs at EPTC
Brewer Science, Inc. will co present two technical papers with imec at the IEEE Electronics Packaging Technology Conference (EPTC) in Singapore, December 2–5, 2025. ...
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November 19, 2025
Imec Unveils imec.kelis: A Breakthrough Tool for AI Datacenter Design and Optimization
This week at Super Computing 2025, the premier international conference and exhibition for high performance computing (HPC), imec announced the launch of imec.kelis ...
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October 28, 2025
Imec Sets Electro-Optic Performance Record in Thin-Film Strontium Titanate at Cryogenic Temperatures
At 4 degrees Kelvin, most electro-optic materials falter. Nanoelectronics R&D center imec has now successfully engineered thin-film strontium titanate (SrTiO₃) that delivers ...
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October 21, 2025
GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program
imec announced that GlobalFoundries (GF) has joined imec's Automotive Chiplet Program (ACP) as a foundry partner. Semiconductor and system companies Infineon, ...
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October 13, 2025
Imec launches 300mm GaN program to develop advanced power devices and reduce manufacturing costs
Imec welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for ...
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October 7, 2025
Luc Van den hove Becomes Chairman, Patrick Vandenameele Appointed as Next CEO of imec
The Board of Directors of imec has appointed Patrick Vandenameele as the next Chief Executive Officer. Effective April 1, 2026, he will succeed current CEO Luc Van den hove ...
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September 25, 2025
Imec achieves new milestones in single patterning High NA EUV lithography
At the 2025 SPIE Photomask Technology + EUV Lithography Conference (Monterey (CA)), imec presents two breakthrough achievements in single print High NA EUV lithography: ...
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June 18, 2025
Imec achieves record-breaking RF GaN-on-Si transistor performance for high-efficiency 6G power amplifiers
Imec has set a new benchmark in RF transistor performance for mobile applications. They present a gallium nitride (GaN) MOSHEMT on silicon (Si) that achieves both record ...
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June 16, 2025
Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission
This week at the 2025 Symposium on VLSI Technology and Circuits, imec announced a significant breakthrough in high-speed digital-to-analog conversion. The new 7-bit ...
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Hermetic Package Automation with HDHS® Technology
Enables Seam Sealing with industry standard tooling including Auer carriers and custom carriers including non-standard square trays. Rapid switchover from one carrier tooling to the next is a PC program change.
MicroCircuit Laboratories, LLC
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