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Sponsor
ZEISS

Improve WLCSP Reliability with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL and Cu-pillar microbumps. Read more.
ZEISS Microscopy
Balazs-Nanoanalysis
Press Release
May 27, 2025  -  Click the title to read the full press release.

SEMI and Purdue University Launch AI and Data Analysis Online Courses



SEMI announced it has partnered with Purdue University to launch an online course series focused on artificial intelligence (AI) and data analysis techniques for the semiconductor ...

SEMI
September 11, 2025
SEMI Showcases New Conductor™ Intelligence Platform for Enhanced Global Supply Chain Collaboration
SEMI announced its new Conductor™ intelligence platform for enhanced supply chain management at SEMICON Taiwan. The platform was developed as part of the SEMI Supply ...
September 10, 2025
AMD's Lisa Su to Receive Inaugural SEMI Silicon Medal at SEMICON West 2025
SEMI announced the introduction of the annual SEMI Silicon Medal, a prestigious award that celebrates semiconductor industry icons driving innovation and excellence. ...
September 9, 2025
SEMI Reports Global Semiconductor Equipment Billings Increased 24% Year-Over-Year in Q2 2025
SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings increased 24% year-over-year ...
August 28, 2025
SEMICON Europa 2025 Spotlights Global Collaborations for European Economic Resilience
SEMICON Europa 2025, co-located with productronica, will return to Munich from November 18-21 to mark its 50th anniversary, bringing together global industry leaders ...
August 27, 2025
Lip-Bu Tan to be Honored With 2025 Phil Kaufman Award
Lip-Bu Tan, Chief Executive Officer of Intel Corporation and former CEO of Cadence Design Systems, will be honored with the 2025 Phil Kaufman Award for distinguished ...
August 20, 2025
SEMICON West 2025 Keynote Program to Explore Trends Shaping the Global Semiconductor Industry
SEMI announced its lineup of confirmed speakers and sessions for this year's SEMICON® West event, taking place from October 7-9 at the Phoenix Convention Center in ...
August 18, 2025
SEMI MEMS and Sensors NextGen Congress 2025 to Explore the Future of Sensing Technology
MEMS and Sensors NextGen Congress (MSNG) 2025 will bring together leaders from across the MEMS and sensors ecosystem from September 16-18 at the SEMI ...
August 13, 2025
SEMI Foundation Launches SEMIquest: An Immersive STEM Experience to Inspire Arizona's Future Tech Talent
The SEMI Foundation, the nonprofit arm of SEMI, announced the launch of SEMIquest, an immersive, hands-on STEM experience designed to ignite curiosity and connect⏈...
August 6, 2025
SEMI NBMC Opens Call to Fund Integrated Biosensing Platforms
The Nano-Bio Materials Consortium (NBMC) released a Request for Proposals (RFP) to advance sensing, diagnostic, and augmentation technologies at the intersection ...
July 31, 2025
SEMI Reports Worldwide Silicon Wafer Shipments Increase 10% Year-on-Year in Q2 2025
The SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 9.6% year-on-year ...
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Sponsor
Ontos-Equipment-Systems

Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
XYZTEC