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Sponsor
DL-Technology

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
Ormet-TLPS
Press Release
May 27, 2025  -  Click the title to read the full press release.

SEMI and Purdue University Launch AI and Data Analysis Online Courses



SEMI announced it has partnered with Purdue University to launch an online course series focused on artificial intelligence (AI) and data analysis techniques for the semiconductor ...

SEMI
January 23, 2026
FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics
The FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid ...
January 21, 2026
SEMI Foundation Approved by the U.S. Department of Labor
The SEMI Foundation announced it has been officially approved by the U.S. Department of Labor (USDOL) as a National Apprenticeship Sponsor, a major milestone that ...
January 20, 2026
SEMI Issues Statement on U.S. Presidential Proclamations on Tariffs for Advanced Semiconductors and Critical Minerals
SEMI released a statement in response to President Trump signing two Presidential Proclamations addressing U.S. semiconductor and critical mineral supply chains. ...
January 13, 2026
ESD Alliance Reports Electronic System Design Industry Posts $5.6 Billion in Revenue in Q3 2025
Electronic System Design (ESD) industry revenue increased 8.8% to $5,566.4 million in the third quarter of 2025 from the $5,114.5 million registered in the third quarter ...
January 12, 2026
SEMI Industry Strategy Symposium 2026 Gathers Executives to Analyze Semiconductor Industry Challenges and Opportunities
SEMI will hold its annual Industry Strategy Symposium (ISS) on Sunday, January 11 through Wednesday, January 14 at the Ritz-Carlton Hotel in Half Moon Bay, Calif. ISS ...
December 18, 2025
Global Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027, SEMI Reports
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of $133 billion in 2025, growing ...
December 16, 2025
SEMICON Korea 2026 to Showcase Core Semiconductor Technologies for the AI Era
As the semiconductor industry enters a transformative growth phase, Korea — a vital hub of the global semiconductor supply chain — is attracting increasing global attention. ...
December 9, 2025
SEMI Reports Global Semiconductor Equipment Billings Increased 11% Year-Over-Year in Q3 2025
SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings increased 11% year-over-year ...
December 3, 2025
Global Semiconductor Equipment Billings Increased 11% Year-Over-Year in Q3
November 20, 2025
SEMI Applauds Introduction of New Bill to Extend U.S. Tax Credit for Semiconductor Manufacturing Suppliers through 2031
SEMI announced support for the introduction of the Strengthening Essential Manufacturing and Industrial Investment Act (the SEMI Investment Act) in the United States House ...
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Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
Surfx-Technologies