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Fine-Pitch MEMS Bonding Precision
Upgrade MEMS cantilever bonding with LAPLACE®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time.
PacTech
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| Press Release |
April 16, 2025 - Click the title to read the full press release.
TechInsights released early-stage findings of its teardown analysis of the NVIDIA Blackwell HGX B200 platform delivering advanced artificial intelligence (AI) and high-performance ...
TechInsights
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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