| Sponsor |
|
Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
|
|
| Press Release |
April 14, 2025 - Click the title to read the full press release.
STMicroelectronics' IIS2DULPX industrial MEMS accelerometer combines machine learning, power saving, and capability to operate at high-temperature, facilitating intensive ...
STMicroelectronics
April 15, 2025
STMicroelectronics unveils next-generation automotive NFC readers
STMicroelectronics has introduced two new automotive NFC readers in its ST25R portfolio, delivering superior wake-up and detection range for enhanced user experiences. ...
|
April 14, 2025
New industrial-grade accelerometer with edge AI and low power for smart sensing
STMicroelectronics' IIS2DULPX industrial MEMS accelerometer combines machine learning, power saving, and capability to operate at high-temperature, facilitating intensive ...
|
April 9, 2025
New Serial EEPROM family features unique ID for identification, traceability, and sustainability
STMicroelectronics has introduced a series of serial EEPROMs that contain a unique 128-bit read-only ID (UID) to meet market requirements for product recognition, tracking ...
|
April 8, 2025
STMicroelectronics releases STM32MP23 microprocessors
STMicroelectronics has announced mass-market availability of new STM32MP23 general-purpose microprocessors (MPUs), combining high-temperature operation up to 125°C ...
|
March 28, 2025
Highly integrated low-side current-measurement amplifier simplifies high-accuracy sensing
STMicroelectronics' TSC1801 low-side current-measurement amplifier integrates matched resistors to set the gain, which simplifies the circuit design, saves bill-of-materials ...
|
March 27, 2025
Intelligent power switches from STMicroelectronics are compact, efficient, and robust
STMicroelectronics' IPS4140HQ and IPS4140HQ-1 are richly featured four-channel intelligent power switches, combining a compact 8 mm x 6 mm footprint, 80mΩ RDS(on) ...
|
March 26, 2025
ST delivers turnkey reference design for low-voltage, high-power motor applications
The EVLSERVO1 servo driver reference design from STMicroelectronics offers a highly compact solution specifically engineered for high-power motor-control applications ...
|
March 14, 2025
65W GaN converter delivers space-saving power for cost-conscious applications
ST's VIPerGaN65D flyback converter, with its SOIC16 outline, permits extremely small and economical power supplies, adapters, and USB-PD (Power Delivery) fast chargers ...
|
March 11, 2025
STMicroelectronics reveals solutions for post-quantum cryptography
STMicroelectronics has introduced hardware cryptographic accelerators and associated software libraries for general-purpose and secure microcontrollers, ready for future ...
|
March 6, 2025
STMicroelectronics' STM32WBA6 combine extra features and performance with power efficiency
STMicroelectronics has announced the next generation of its STM32 power-efficient short-range wireless microcontrollers (MCUs) that simplify connecting consumer and industrial ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation
|
|
|
