Sponsor

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

March 28, 2025 - Click the title to read the full press release.

Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels

Toray Engineering Co., Ltd., has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging "PLP". PLP is an advanced ...

Toray Engineering

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH