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March 18, 2025  -  Click the title to read the full press release.

DuPont Announces CEO and Non-Executive Chair for the Planned Independent Electronics Company



DuPont announced Jon Kemp, President, DuPont Electronics & Industrial will be the Chief Executive Officer and a member of the board of directors for the future independent ...

DuPont
March 18, 2025
DuPont Announces CEO and Non-Executive Chair for the Planned Independent Electronics Company
DuPont announced Jon Kemp, President, DuPont Electronics & Industrial will be the Chief Executive Officer and a member of the board of directors for the future independent ...
June 11, 2024
DuPont's Randal King Joins Purdue University's Semiconductor Degrees Leadership Board
DuPont announced that Randal King, PhD, Vice President of R&D/Technology, DuPont Electronics & Industrial, has been named to Purdue University's Semiconductor ...
March 4, 2024
Jon Kemp Named Chair of SEMI Board of Industry Leaders
DuPont announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry ...
December 21, 2023
DuPont Recognized as Best ESG Partner by Samsung Electronics
DuPont announced it has been named the Best Partner in the Environmental, Social and Governance (ESG) category by Samsung Electronics. The prestigious award, ...
February 3, 2022
VIEWPOINT 2022: Dennis Chen, Global Business Director, Advanced Packaging Technologies, DuPont Electronics & Industrial
While things have developed in different ways across our regions in 2021, there's been one constant: Our teams around the world have shown great resilience in navigating yet another pandemic year. Our business has delivered strong growth, and we have shipped products steadily despite some supply ...
September 28, 2021
DuPont Adds Boric Acid-Free Electrolytic Nickel to its Nikal™ BP Family
DuPont Electronics & Industrial business announced it has expanded its family of Nikal™ BP plating chemistries with the addition of Nikal™ BP BAF Ni electrolytic nickel. The new ...
March 10, 2021
DuPont Announces Acquisition of Laird Performance Materials
DuPont announced that it has entered into a definitive agreement with Advent International, one of the world's largest private equity firms, to acquire Laird Performance ...
February 19, 2021
VIEWPOINT 2021: Rob Kavanagh, Global Business Director, Advanced Packaging Technologies, DuPont Electronics & Imaging
In the semiconductor industry, we rely on industry analysts' reports and customer insights to help plan our annual business strategies. But nobody could have predicted the COVID-19 pandemic or the impact it would have. At best, we can examine what has happened, count our blessings, and use what we learned to emerge ...
August 25, 2020
DuPont Announces Upcoming Webinar, Boosting Performance of Circuits in High Frequency Applications
DuPont Electronics & Imaging will host a webinar, Boosting the Performance of Circuits in High Frequency Applications, on August 25 to discuss leading factors that impact ...
September 1, 2009
Materials Charaterization for Thin Wafer Processing
DuPont Wafer Level Packaging (WLP) Solutions recently presented an overview of wafer level packaging materials to meet the challenges of ...
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How to Cold Bump Pull?
Learn how to perform an optimal Cold Bump Pull test on solder balls using tweezers. This guide covers test method settings and failures modes for CBP all types of bump testing.
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