semiconductor
packaging news
Sponsor
Amkor-Technology

Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.
Balazs-Nanoanalysis
Press Release
March 13, 2025  -  Click the title to read the full press release.

Infotech's Headquarters is Moving!



For over 20 years, Infotech AG has been headquartered in Solothurn, Switzerland. Due to our remarkable success, we are excited to announce the relocation of our headquarters ...

Infotech Automation Inc.
April 3, 2025
Infotech's US branch has appointed a new CEO
Infotech Automation Inc. has appointed Kenn Yurch as its new CEO/President, effective April 1, 2025. Simon Hofer, who held the position for the past 18 months, will be voluntarily ...
March 13, 2025
Infotech's Headquarters is Moving!
For over 20 years, Infotech AG has been headquartered in Solothurn, Switzerland. Due to our remarkable success, we are excited to announce the relocation of our headquarters ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Dr.-Tresky-AG

1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
Akrometrix