| Press Release |
March 5, 2025 - Click the title to read the full press release.
As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at APEC ...
Indium Corporation
June 4, 2026
Breaking Thermal Barriers: Indium to Present Metal TIMs Solutions for Next-Gen Electronics at FINE 2026
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how advanced metal thermal interface materials (TIMs) can achieve new performance thresholds ...
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June 3, 2026
Indium Corporation to Feature AuLTRA® Die-Attach Solutions at IMS 2026
As an industry leader in innovative materials solutions for critical RF/microwave applications, Indium Corporation® will highlight its high-reliability, gold-based precision die-attach ...
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June 2, 2026
Indium Corporation Brings AI-Enabling Power Electronics Solutions to PCIM Expo
As a leading provider of high-reliability materials for all power electronics devices, Indium Corporation® will showcase its AI-enabling portfolio of products at PCIM Expo 2026 ...
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May 29, 2026
Indium Experts Address Power Electronics and Thermal Management Solutions at PCIM Expo 2026
Indium Corporation® will feature three experts addressing critical industry challenges at PCIM Expo 2026, June 9-11, in Nuremberg, Germany. Improving Thermomechanical Reliability ...
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May 28, 2026
Indium Corporation Receives ASE Technology Sustainability Award
Indium Corporation® received a Sustainability Award from ASE Technology Holding Co., Ltd. (ASE) at their recent 2025 Best Suppliers Award Ceremony in Taichung, Taiwan. ...
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May 26, 2026
Indium Corporation to Highlight Power Device Packaging Solutions at ECTC 2026
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of products ...
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May 19, 2026
Indium to Present on Metal TIMs Solutions for Demanding Thermal Environments at CSPT
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of next-generation ...
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May 18, 2026
Indium Corporation Expert to Present sTIMs Solution for AI Thermal Challenges at IEEE ECTC
Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal ...
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May 14, 2026
Indium Corporation Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical ...
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May 7, 2026
Indium Corporation to Present High-Performance AI Application Solutions at SEMICON SEA 2026
As a leading provider of advanced materials solutions enabling today's demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge ...
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| Sponsor |
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Amkor's Double Sided Molded BGA Solutions
To improve the integration of RFFE solutions, Amkor offers a DSMBGA package that allows molded assembly of components on both sides of the substrate.
Amkor Technology, Inc.
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