semiconductor
packaging news
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Amkor-Technology
Press Release
January 28, 2025  -  Click the title to read the full press release.

Upgraded sensor board accelerates plug-and-play evaluation with ST MEMS Studio



Developing context-aware applications with MEMS sensors is faster, more powerful, and more flexible with ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. ...

STMicroelectronics
November 7, 2025
STMicroelectronics empowers data-hungry industrial transformation with unique dual-range motion sensor
STMicroelectronics has revealed the ISM6HG256X, a tiny three-in-one motion sensor for data-hungry industrial IoT applications, serving as an additional catalyst for edge ...
October 29, 2025
STMicroelectronics' integrated GaN flyback converters simplify design and silence audible noise
STMicroelectronics is introducing a series of GaN flyback converters that simplify designing and building compact, efficient USB-PD chargers, fast battery chargers, and auxiliary ...
October 22, 2025
Singapore's largest industrial district cooling system begins operations
STMicroelectronics and SP Group (SP) have commenced operations for Singapore's largest industrial district cooling system at STMicroelectronics' (ST) Ang Mo Kio ...
October 21, 2025
ST introduces new image sensors for industrial automation, security and retail applications
STMicroelectronics introduces a new family of 5MP CMOS image sensors: VD1943, VB1943, VD5943, and VB5943. These advanced ST BrightSense sensors are designed ...
October 16, 2025
STMicroelectronics' half-bridge gate drivers ease design with GaN in low-voltage systems
STMicroelectronics' STDRIVEG210 and STDRIVEG211 half-bridge gallium nitride (GaN) gate drivers are tailored for systems powered from industrial or telecom bus voltages, ...
October 14, 2025
STMicroelectronics powers 48V mild-hybrid efficiency with flexible automotive 8-channel gate driver
Ready for 48V automotive power architectures, the L98GD8 driver from STMicroelectronics has eight fully configurable channels for driving MOSFETs in flexible high-side ...
October 9, 2025
Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology
Tobii and STMicroelectronics announced the beginning of mass production of an advanced interior sensing system for a premium European carmaker. It integrates a wide ...
October 6, 2025
STMicroelectronics' automotive linear voltage regulator preserves battery energy in challenging conditions
L99VR03 300mA low-dropout (LDO) regulator provides resilient and efficient power, with a wide input-voltage range and very low quiescent current consumption, only 3.5µA ...
September 26, 2025
STARLight Project chosen to take the lead in next-gen Silicon Photonics on 300mm wafers
The STARLight project brings together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics (SiPho) ...
September 25, 2025
STMicroelectronics joins FiRa board
STMicroelectronics has announced that Rias Al-Kadi, General Manager of the Company's Range and Connectivity Division, has joined the board of directors of the FiRa® ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Master-Bond

Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
Akrometrix